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 STM8601
S a mHop Microelectronics C orp.
Ver 1.0
Dual Enhancement Mode Field Effect Transistor ( N and P Channel )
PRODUCT SUMMARY (N-Channel)
VDSS
60V
PRODUCT SUMMARY (P-Channel)
VDSS
-60V
ID
4.5A
RDS(ON) (m) Max
58 @ VGS=10V
ID
-3.3A
RDS(ON) (m) Max
105 @ VGS=-10V 150 @ VGS=-4.5V
75 @ VGS=4.5V
D2 D2
5 6 7 8
4 3 2 1
G2 S2 G1 S1
S O-8 1
D1 D1
ABSOLUTE MAXIMUM RATINGS ( T A=25 C unless otherwise noted ) Symbol VDS VGS ID IDM E AS PD TJ, TSTG Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous -Pulsed
b d a
N-Channel 60 20 TA=25C TA=70C 4.5 3.6 16 15 TA=25C TA=70C 2.0 1.28
P-Channel -60 20 -3.3 -2.6 12 20
Units V V A A A mJ W W C
Single Pulse Avalanche Energy Maximum Power Dissipation
a
Operating Junction and Storage Temperature Range
-55 to 150
THERMAL CHARACTERISTICS R JA Thermal Resistance, Junction-to-Ambient
a
62.5
C/W
Details are subject to change without notice.
Nov,06,2008
1
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STM8601
Ver 1.0
N-Channel ELECTRICAL CHARACTERISTICS ( TA=25 C unless otherwise noted )
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS BVDSS IDSS IGSS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current
VGS=0V , ID=250uA VDS=48V , VGS=0V
60 1 100
V uA nA
VGS= 20V , VDS=0V
ON CHARACTERISTICS VGS(th) RDS(ON) gFS Gate Threshold Voltage Drain-Source On-State Resistance Forward Transconductance
c
VDS=VGS , ID=250uA VGS=10V , ID=4.5A VGS=4.5V , ID=4A VDS=5V , ID=4.5A
1
1.9 48 55 12
3 58 75
V m ohm m ohm S
DYNAMIC CHARACTERISTICS Input Capacitance CISS COSS CRSS Output Capacitance
852 VDS=30V,VGS=0V f=1.0MHz 72 45
pF pF pF
Reverse Transfer Capacitance
c
SWITCHING CHARACTERISTICS Turn-On Delay Time tD(ON) tr Rise Time tD(OFF) tf Qg Qgs Qgd Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD=30V ID=1A VGS=10V RGEN=3.3 ohm VDS=30V,ID=4.5A,VGS=10V VDS=30V,ID=4.5A,VGS=4.5V VDS=30V,ID=4.5A, VGS=10V
12 11 37.5 8 14 6.7 1.75 2.9
ns ns ns ns nC nC nC nC
DRAIN-SOURCE DIODE CHARACTERISTICS IS VSD Maximum Continuous Drain-Source Diode Forward Current Diode Forward Voltage
b
2 0.8 1.2
A V
VGS=0V,IS=2A
Nov,06,2008
2
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STM8601
Ver 1.0
P-Channel ELECTRICAL CHARACTERISTICS ( TA=25 C unless otherwise noted )
Symbol Parameter Conditions
VGS=0V , ID=-250uA VDS=-48V , VGS=0V
Min
Typ
Max
Units V
OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS IGSS Gate-Body Leakage Current
-60 -1 100
uA nA
VGS= 20V , VDS=0V
ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) gFS Drain-Source On-State Resistance Forward Transconductance
c
VDS=VGS , ID=-250uA VGS=-10V , ID=-3.3A VGS=-4.5V , ID=-2.8A VDS=-5V , ID=-3.3A
-1.0
-1.8 85 110 7
-3.0 105 150
V m ohm m ohm S
DYNAMIC CHARACTERISTICS Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge
c
VDS=-30V,VGS=0V f=1.0MHz
730 68 43
pF pF pF ns ns ns ns nC nC nC nC
VDD=-30V ID=-1A VGS=-10V RGEN=3.3 ohm VDS=-30V,ID=-3.3A,VGS=-10V VDS=-30V,ID=-3.3A,VGS=-4.5V VDS=-30V,ID=-3.3A, VGS=-30V
12.4 10.5 65 23 14 6.7 1.5 3.3
DRAIN-SOURCE DIODE CHARACTERISTICS Maximum Continuous Drain-Source Diode Forward Current IS VSD Diode Forward Voltage
b
-2 -0.81 -1.2
A V
VGS=0V,IS=-2A
Notes
_ a.Surface Mounted on FR4 Board,t < 10sec. _ _ b.Pulse Test:Pulse Width < 300us, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing. d.Starting TJ=25C,L=0.5mH,VDD=20V,VGS=10V.(See Figure13)
Nov,06,2008
3
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STM8601
Ver 1.0
N-Channel
30
V G S = 10V
15
ID, Drain Current(A)
V G S = 4V
ID, Drain Current(A)
24
V G S = 4.5V
12
18
V G S =3.5V
9
12
V G S = 3V
6 125 C 3 25 C 0 -55 C
6 0 0 0.5 1.0 1.5 2.0
V G S = 2.5V
2.5
3.0
0
0.8
1.6
2.4
3.2
4.0
4.8
VDS, Drain-to-Source Voltage(V)
VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
90 75
Figure 2. Transfer Characteristics
2.0 1.8 1.6 1.4 1.2 1.0 0 0 25 50 75 100 125 150 T j ( C )
V G S =4.5V ID=4A V G S =10V ID= 4.5A
RDS(on)(m )
60 45 30 15 0 0 6
VGS =4.5V
VGS =10V
12
18
24
30
RDS(on), On-Resistance Normalized
ID, Drain Current(A)
Tj, Junction Temperature( C )
Figure 3. On-Resistance vs. Drain Current and Gate Voltage
1.4
Figure 4. On-Resistance Variation with Drain Current and Temperature
BVDSS, Normalized Drain-Source Breakdown Voltage
1.15 ID=250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150
Vth, Normalized Gate-Source Threshold Voltage
1.2 1.0 0.8 0.6 0.4 0.2 0 -50 -25 0 25 50
V DS =V G S ID=250uA
75 100 125 150
Tj, Junction Temperature( C )
Tj, Junction Temperature( C )
Figure 5. Gate Threshold Variation with Temperature 4
Figure 6. Breakdown Voltage Variation with Temperature
Nov,06,2008
www.samhop.com.tw
STM8601
Ver 1.0
120 100 125 C
20.0
Is, Source-drain current(A)
ID=4.5A
10.0
RDS(on)(m )
80 75 C 60
25 C
5
125 C 25 C
40 20 0
75 C
0
2
4
6
8
10
1.0
0
0.3
0.6
0.9
1.2
1.5
VGS, Gate-to-Source Voltage(V)
VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs. Gate-Source Voltage
1200
Figure 8. Body Diode Forward Voltage Variation with Source Current
10
VGS, Gate to Source Voltage(V)
1000
C, Capacitance(pF)
C is s 800 600 400 200 0 0 C rs s 5 10 15 20 25 30
8 6 4 2 0 0
VDS = 30V ID=4.5A
Cos s
2
4
6
8
10
12
14 16
VDS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
300 100
50
it
10
10
ID, Drain Current(A)
Switching Time(ns)
TD(off )
RD
S
(
) ON
L im
TD(on)
1
10
DC
10
1m
0u
s
s
0m
ms
10
Tr
s
Tf
VDS=30V,ID=1A VGS=10V
0.1
VGS=10V Single Pulse TA=25 C
1 10 60 300
1 1 10 100
0.02 0.1
Rg, Gate Resistance()
VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Nov,06,2008
5
www.samhop.com.tw
STM8601
Ver 1.0
15V
V ( BR )D S S
tp
VDS
L
D R IVE R
RG
20V
D .U .T
IA S tp
+ - VD D
A
0.0 1
IAS
Unclamped Inductive Test Circuit F igure 13a.
Unclamped Inductive Waveforms F igure 13b.
10
Normalized Transient Thermal Resistance
1
0.5 0.2
0.1
P DM t1 t2 1. 2. 3. 4. R J A (t)=r (t) * R J A R J A=S ee Datas heet T J M-T A = P DM* R J A (t) Duty C ycle, D=t1/t2
0.1
0.05 0.02 0.01
Single Pulse
0.01 0.00001
0.0001
0.001
0.01 0.1 1 Square Wave Pulse Duration(sec) Normalized Thermal Transient Impedance Curve
10
100
1000
Nov,06,2008
6
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STM8601
Ver 1.0
P-Channel
10
V G S = -10V V G S = -4.5V V G S = -3.5V
15
-ID, Drain Current(A)
-ID, Drain Current(A)
8
12
6
V G S = -4V
9
4 2
V G S = -3V
6 25 C 3 125 C -55 C 2.7 3.6 4.5 5.2 0
0 0 0.5 1.0 1.5 2.0 2.5 3.0
0
0.9
1.8
-VDS, Drain-to-Source Voltage(V)
-VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
240 200
Figure 2. Transfer Characteristics
2.0 1.8 1.6 1.4 1.2 1.0 0
V G S =-4.5V ID= -2.8A V G S =-10V ID =-3.3A
RDS(on)(m )
160 120 80 40 1 VG S =-4.5V
VGS =-10V
1
2
4
6
8
10
RDS(on), On-Resistance Normalized
0
25
50
75
100
125
150 T j ( C )
-ID, Drain Current(A)
Tj, Junction Temperature( C )
Figure 3. On-Resistance vs. Drain Current and Gate Voltage
1.6
Figure 4. On-Resistance Variation with Drain Current and Temperature
BVDSS, Normalized Drain-Source Breakdown Voltage
1.15 ID=-250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150
Vth, Normalized Gate-Source Threshold Voltage
1.4 1.2 1.0 0.8 0.6 0.4 0.2 -50 -25 0 25 50
V DS =V G S ID=-250uA
75 100 125 150
Tj, Junction Temperature( C )
Tj, Junction Temperature( C )
Figure 5. Gate Threshold Variation with Temperature
Figure 6. Breakdown Voltage Variation with Temperature
Nov,06,2008
7
www.samhop.com.tw
STM8601
Ver 1.0
300 250
20
-Is, Source-drain current(A)
ID=-3.3A
10
125 C 25 C
RDS(on)(m )
200 125 C 150 100 75 C 50 0
25 C
75 C
0
2
4
6
8
10
1 0 0.3 0.6 0.9 1.2 1.5
-VGS, Gate-to-Source Voltage(V)
-VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs. Gate-Source Voltage
1200
Figure 8. Body Diode Forward Voltage Variation with Source Current
10
-VGS, Gate to Source Voltage(V)
1000
C, Capacitance(pF)
8 6 4 2 0
VDS = -30V ID=-3.3A
800 600 400 200 0 Cos s C rs s 0 5
C is s
10
15
20
25
30
0
2
4
6
8
10
12
14 16
-VDS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
300 100
50
-ID, Drain Current(A)
TD(off )
10
( ) ON L im
it
10 s 1 0 ms 0m s DC
1m
Switching Time(ns)
10
0u
s
Tr
Tf
TD(on)
R
DS
1
10
VDS=30V,ID=1A VGS=10V
0.1
VGS=10V Single Pulse TA=25 C
1 10 60 300
1 1 6 10 60 100
0.02 0.1
Rg, Gate Resistance()
-VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Nov,06,2008
8
www.samhop.com.tw
STM8601
Ver 1.0
15V
V ( BR )D S S
tp
VDS
L
D R IVE R
RG
20V
D .U .T
IA S tp
+ - VD D
A
0.0 1
IAS
Unclamped Inductive Test Circuit F igure 13a.
Unclamped Inductive Waveforms F igure 13b.
10
Normalized Transient Thermal Resistance
1
0.5 0.2 0.1
P DM t1 t2 1. RthJA (t)=r (t) * R th JA 2. R thJA=See Datasheet 3. TJM-TA = PDM* R thJA (t) 4. Duty Cycle, D=t1/t2
0.1
0.05 0.02 0.01
Single Pulse 0.01 0.00001
0.0001
0.001
0.01 0.1 1 Square Wave Pulse Duration(sec) Normalized Thermal Transient Impedance Curve
10
100
1000
Nov,06,2008
9
www.samhop.com.tw
STM8601
Ver 1.0
PACKAGE OUTLINE DIMENSIONS SO-8
1 L
E D
0.015X45
A
e
0.05 TYP.
B
0.016 TYP.
A1
0.008 TYP.
C
H
MILLIME T E R S S Y MB OLS MIN A A1 D E H L 1.35 0.10 4.80 3.81 5.79 0.41 0 MAX 1.75 0.25 4.98 3.99 6.20 1.27 8 MIN 0.053 0.004 0.189 0.150 0.228 0.016 0
INC HE S MAX 0.069 0.010 0.196 0.157 0.244 0.050 8
Nov,06,2008
10
www.samhop.com.tw
STM8601
Ver 1.0
SO-8 Tape and Reel Data
SO-8 Carrier Tape
P1 D1 P2
A
E1 E2
B0
A0
D0
P0
A
TERMINAL NUMBER 1
T
SECTION A-A
K0
FEEDING DIRECTION
unit:
PACKAGE SOP 8N 150 A0
6.50 0.15
B0
5.25 0.10
K0
2.10 0.10
D0
1.5 (MIN)
D1
1.55 0.10
E
12.0 +0.3 - 0.1
E1
1.75 0.10
E2
5.5 0.10
E
P0
8.0 0.10
P1
4.0 0.10
P2
2.0 0.10
T
0.30 0.013
SO-8 Reel
W1
S G N
R H W
UNIT:
V
M
TAPE SIZE
12
REEL SIZE
330
M
330 1
N
62 1.5
W
12.4 + 0.2
W1
16.8 - 0.4
H
12.75 + 0.15
K
S
2.0 0.15
G
R
K V
Nov,06,2008
11
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